The photosensitive resin composition, a manufacturing method of a photosensitive element, resist pattern forming method and printed wiring board using the same

The photosensitive resin composition of the present invention, (A) a binder polymer, a photopolymerizable compound having a (B) an ethylenically unsaturated group, and contains a photopolymerization initiator (C) as the component (B) , those containing a compound represented by the following general formula (I). [Formula 1] ## STR2 ## A group represented by, or the following general formula (III): [Formula 3] In indicates a ]