A PARAMETRIC DESIGN FRAMEWORK TO SUPPORT STRUCTURAL AND FUNCTIONAL MODELING OF COMPLEX CONSUMER ELECTRONICS PRODUCTS

Today's market demand for smaller and more powerful consumer electronic devices poses a major challenge to the rapid design of products. In addition, the ability to perform strategic coordination among different stakeholders within the enterprise increasingly becomes an important criterion for global engineering. In this study, we first introduce a typical design process involving distributed design teams. In particular, this process allows a thermal–acoustic design of cavities, i.e., air space inside the enclosure, in terms of flow rate and acoustic radiation resistance. Then, we investigate a module-based design optimization approach defining cavity as a module to efficiently support such processes. We ensure the design control of both cavity characteristics in an internationally distributed project through design data analysis using the Systems Modeling Language (SysML) and the resulting product model descriptions of the system architecture.