Load chamber and a multi-chamber processing system applying the load chamber

The invention discloses a load chamber and a multi-chamber processing system applying the load chamber. The load chamber disclosed by the invention comprises a chamber body. The chamber body comprises at least one pair of chambers for bearing one or more wafer substrates; and at least one inner pipeline which is arranged between the pair of chambers and is connected with the pair of chambers, thus backfilling or extracting the gas of the pair of chambers. The load chamber is equipped with multi-layer structures. Any one of the multi-layer structures comprises the pair of chambers. The chamber body comprises a frame. The frame is equipped with a plurality of inner walls. The pair of chambers is defined by the inner walls. The chamber body also comprises a plurality of cover boards. The cover boards are detachably combined on the frame. The pair of chambers is defined by the cover boards and the inner walls of the frame.