Adhesive composition for multi-layered fpcb and manufacturing method by using it

An adhesive composition for the interlayer insulation adhesive film of a multilayered flexible printed circuit board(FPCB), and a method for preparing the multilayered flexible printed circuit board by using the composition are provided to improve fast curing property, film management and storage stability remarkably. An adhesive composition for a multilayered flexible printed circuit board comprises a thermoplastic binder resin; a thermosetting resin; a curing agent; a radical polymerizable compound; a radical initiator; and an additive, wherein the adhesive strength is such that a peel strength is 1.3-1.8 kgf/cm^2 at a velocity of 50 mm/min of a copper foil and a curing specimen, and the bubble generation area is 1-10 % of the total area of the curing specimen when the curing specimen is dipped in a lead bath (260±5 deg.C, 30±5 sec).