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Acemap > Paper > A 3D IC Self-test and Recovery Method Based on Through Silicon Via Defect Modeling: A 3D IC Self-test and Recovery Method Based on Through Silicon Via Defect Modeling

A 3D IC Self-test and Recovery Method Based on Through Silicon Via Defect Modeling: A 3D IC Self-test and Recovery Method Based on Through Silicon Via Defect Modeling

2013 
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