A process for producing a composite material, associated composite material and associated semiconductor circuitry

The invention relates to a process for producing a composite material, a corresponding composite material and associated semiconductor circuitry, wherein a plurality of first electrically conductive material particles (W1) on a carrier substrate (TS) can be applied and a second electrically conductive material (W2) in such a way at the surface of Werstoffteilchen first (W1) is electrodeposited in that it the plurality of first particles of material (W1) mechanically and electrically to each other.