Packing structure of sensor and production thereof

One kind of sensor package structure and a manufacturing method, the sensor package structure includes a lower substrate, a transparent substrate, and a plurality of spacer adhesive. The lower substrate comprises a plurality of wafers, each wafer including an active surface and an image sensor disposed on the active surface. The transparent substrate is a transparent substrate comprising a plurality of units, respectively corresponding to the plurality of wafers, wherein each of the transparent substrate unit are located above the active surface of the wafer, and covering the image sensing element. The spacer is disposed between the chip unit and the transparent substrate, a transparent substrate for the pitch of each unit, and an image sensing element is kept at a predetermined pitch. For each of the adhesive means and a transparent substrate wafer together. The cost of the image sensor package structure can be mass-manufactured and packaged so that the process can be reduced, the reliability of the package can be improved, and the volume of the image sensor package structure does not become large.