A process for the preparation of a two-chip assembly and corresponding two-chip assembly

The invention provides a method for producing a two-chip assembly and a corresponding two-chip assembly. The method comprises the steps of: providing a wafer (1) having a first thickness (d1) having a front side (VS) and a rear side (RS), and in which a first plurality of the first chip (1a, 1b, 1c) comprises, which on the front side (VS) of the wafer (1) are connected; Connecting a second plurality of second chips (2a, 2b, 2c) on the front side (VS) of the wafer (1), so that each first chip (1a, 1b, 1c) each having a second chip (2a, 2b, 2c) is connected to form a respective two-chip pair; Forming a continuous mold housing (MG) on the front side (VS) of the wafer (1), so that the second chip (2a, 2b, 2c) are packaged; Backthinning of the wafer (1) from the rear side (RS) ago to a second thickness (d2) which is smaller than the first thickness (d1); Forming vias (D1-D6) from the rear side (RS) ago to the second chip (2a, 2b, 2c); and separating the two chip pairs in corresponding two-chip arrangements (3a, 3b, 3c)