Thermal Modeling and Validation of a Real-World Mobile AP

Editor’s note: Thermal issues are plaguing high-performance systems because of their high power consumption, and mobile systems because of their form factor and compactness. Researchers have developed tools and design methodologies to model, predict, and optimize thermal aspects, but it has remained a challenge to validate them against real systems. This paper is valuable by focusing on a commercial mobile application processor and validating the widely used models in the research community with experimental measurements using an IR camera. —Mircea R. Stan .