Cost-effective TSV redundancy configuration

Despite of distinct benefits, such as small form factor, low power consumption, and high performance, the high fabrication cost from both low yield and large area of through-silicon-via (TSV) still keeps three-dimensional integrated circuit (3D IC) from being commercialized in the industry. Inserting additional TSVs (i.e., TSV redundancy) is a well-known solution to increase fabrication yield of 3D IC. However, considering the significant overhead of TSV redundancy, a design-time optimization process is required to find cost-minimal TSV redundancy configuration. In this paper, we proposed a fabrication cost model for 3D IC which takes the TSV redundancy configuration into account. The analytical cost model has been explored with various number of TSVs, to find cost-minimal TSV redundancy configuration. We have also investigated fabrication cost of 3D IC with respect to the failure rate of TSV itself, which show a trend of fabrication cost for future TSV technology.