Shaping interconnect technology for an interconnected society

The continuous drive to increase the functionality of electronic products in terms of computational efficiency and versatility requires a broad range of interconnect technologies. This paper presents an overview of advanced CMOS Interconnect technology scaling towards the 10 nm node enabling the increase in 2D computational density. Functional versatility is enabled by 3D interconnection technologies to build heterogeneous Systems-In-Package. The convergence of bio technologies and electronics will bring a new wave of smart energy efficient miniaturized electronic systems capable to sense and respond to humans.