Wafer copper film thickness off-line measuring module control system

The invention discloses a wafer copper film thickness off-line measuring module control system which adopts a two-level control module of an upper layer control system and a bottom layer control system. The upper layer control system and the bottom layer control system are in physical connection through industrial Ethernet. According to the bottom layer control system, a PLC is adopted to be in charge of directly controlling all parts of an off-line measuring module. According to the upper layer control system, an IPC is adopted to monitor the states of the off-line measuring module in real time through the PLC, operational software is provided for a technologist, and managing of data is achieved. According to the technological requirements, two main measurement patterns including an XY pattern and a global pattern are set. The technological procedures are divided into the standardization process and the measurement process. According to the upper layer control system software, a drawing subprogram is achieved through Matlab, and the drawing subprogram is called flexibly through a main program. The wafer copper film thickness off-line measuring module control system has the advantages of being lossless in test, easy to operate, convenient to maintain, safe and reliable.