Flow guide heat sink and flow guide heat dissipating method

The invention provides a flow guide heat sink and applies to an electronic device. The flow guide heat sink comprises a flow guide vane, a temperature detection unit, and a flow guide vane control unit. The flow guide van comprises an adjustable flow guide angle. The temperature detection unit is used for obtaining temperature difference of a first zone and a second zone inside the electronic device. The flow guide vane control unit is used for setting the flow guide angle of the flow guide vane according to the temperature difference. The flow guide heat sink can effectively dissipate heat. Besides, the invention further provides a flow guide heat dissipating method.