Through Oxide Via (TOV) Induced Fabrication Stress on Directional Couplers in a Si Photonic Interposer

To study how though- oxide-via (TOV) induced stress affects light propagation, a numerical model is constructed using the commercially available finite element analysis (FEA) software COMSOL Multiphysics 5.4a. In the model, directional couplers are used to analyze wavelength shifts as TOV structures are placed at varying distances away. Increasing the number of TOVs in proximity to directional couplers is also explored. Finally, determining the need for a keep-out-zone is assesed for directional couplers fabricated in a silicon photonic interposer.