A thermosetting resin composition and uses thereof

The present invention relates to a thermosetting resin composition, said resin composition comprising: (A) an epoxy resin containing the molecular backbone structure of the naphthol; (B) a cyanate ester compound and / or a cyanate ester prepolymers; (C) poly-phosphonate and / or phosphonate - carbonate copolymers. The present invention provides a thermosetting resin having a low dielectric constant, dielectric loss tangent, the above-described thermosetting resin composition and a prepreg prepared copper-clad laminate having excellent dielectric properties, heat resistance properties, flame retardancy achieve UL94? Of V-0 and good processability process.