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A Study of Material Removal Characteristics by Friction Monitoring System of Sapphire Wafer in Single Side DMP
A Study of Material Removal Characteristics by Friction Monitoring System of Sapphire Wafer in Single Side DMP
2016
Wonseok Jo
Sangjik Lee
Hyoungjae Kim
Taekyung Lee
Seongbeom Lee
Keywords:
Wafer
Sapphire
Materials science
Metallurgy
material removal
sapphire wafer
monitoring system
Optoelectronics
Correction
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