Development of free-standing InGaN LED devices on Al2O3/Si substrate by wet etching

Free-standing InGaN-based LEDs grown on Al2O3/Si (1?1?1) have been achieved using selective area wet etching. Conventional device design was used for LED fabrication, in which p-type and n-type contacts are located at the same side of the epilayers. These LED devices were bonded to a dual in-line package (DIP), and epoxy was used to protect the front side of the epilayers as well as the bonding wires. The silicon substrate was selectively removed by wet etching while the chip was mounted in a DIP which prevented the thin film from cracking or warping. No significant change in electrical characteristics, peak emission wavelength or EL intensity versus drive current was observed. The substrate-removal process and the challenges involved are discussed. Such packaging techniques could be beneficial for commercial-scale production of InGaN-based LEDs grown on silicon substrates.