High performance plastic packaged 100 W L-band Quasi-MMIC HPA

This paper describes the development and the obtained results of a state of the art 100 W L-band Quasi-MMIC HPA packaged in QFN. Innovative power passive MMIC technology is combined with high performance GaN technology in order to provide highly integrated solution compatible to low cost packaging. The measured devices shows an output power of 110 W with more than 55 % PAE at 1.3 GHz. To our knowledge, this is the first Internally-Matched plastic packaged device proposed at this performance level.