Mathematical Modeling of Machining Parameters in Electrical Discharge Machining of FW4 Welded Steel

2009 
Disclosed is a photosensitive composition comprising a diazo resin and a polymeric compound containing a structural unit represented by the following formula (I) in the molecule: Formula (I) wherein J represents a divalent linking group and n is 0 or 1. Disclosed is also a photosensitive lithographic printing using the photosensitive composition.
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