Electrical repair of multilayer ceramic (MLC) substrates

Ah st ract Electrically dcfcctive multilayer ceramic (MLC) substrates have historically been rcpaired using two primal?; methodolog~cs. both of \sldch have limitations Ilrat prevent thcir usage in new, high-performancc, MCM applications. A new repair mclhodolp has been developed whch utilizes pre-designed: spare internal nets within the substrate. Using new technology elements. a repair process has been developed whicli can isolate a defective net from within the substrate and then pmvidc a means to reconnect the clup interconnect (C1) to a spare net, rebuilding the electrical path.