The semiconductor module and the electric drive vehicle

Providing an electric drive vehicle using semiconductor module and it has improved cooling capability. A first semiconductor element 1a, a second semiconductor element 1b, a first heat spreader 2a which is electrically and thermally connected to the lower surface of the first semiconductor element 1a, electrical and thermal to the lower surface of the second semiconductor element 1b a second heat spreader 2b connected to, comprises a first metallic foil 4a2 on the upper surface of the ceramic insulating substrate 4a1, a second metal foil 4a3 on the lower surface, the lower surface of the first metal foil 4a2 first heat spreader 2a and second a DCB substrate 4 which is electrically and thermally bonded to the lower surface of the heat spreader 2b, and a cooler 5 that is thermally connected to the second metal foil 4a3 of DCB substrate 4, the flow direction of a refrigerant cooler said first semiconductor device 1a disposed upstream against, the second semiconductor element 1b is arranged on the downstream side than the area of ​​the second heat spreader 2b area of ​​the first heat spreader 2a And listen.