A low temperature and pressure injection molding machine using hot melt

An injection molding machine is provided to protect a circuit board and electronic components within the circuit board from being damaged and caused by high temperature and high pressure, by using resin molded at low temperature and low pressure, and to reduce production time by using two lower molds. A low-temperature and low-pressure injection molding machine using hot melt comprises an upper mold(210), a lower mold, a press unit, a transfer unit, a material storage unit, a material feeding unit, and a controller(300). The upper and lower molds are configured to mount an electronic component to be injection molded, wherein lower mold comprises a first lower mold(110) and a second lower mold(110') on opposite ends of a transfer plate(103) formed on a pair of rails, and the insides of upper and lower molds have constant-temperature circulation system which enables heating of molds and temperature adjustment. The press unit controls the upper mold. The transfer unit enables the lower mold to move. The material storage unit stores resin to be injection molded. The material feeding unit injects stored resin into the molds. The controller controls an operation of the injection molding machine.