Integrally-packaged high-power LED (Light Emitting Diode) device

The utility model provides an integrally-packaged high-power LED (Light Emitting Diode) device which comprises a bracket and LED chips, wherein the bracket comprises a ceramic base and a copper baseplate; the LED chips are bound on the copper baseplate through a noble metal heat-conducting binding material and are arranged in a matrix mode that two adjacent rows are staggered; contacts of the adjacent LED chips are welded through a cambered gold thread; and the contact of each LED chip and the copper baseplate connected with positive and negative poles are welded through a cambered gold thread. The device provided by the utility model has the beneficial effects that in terms of designs of light acquiring efficiency, heat dispersion and current density, such a package structure is optimal.