Old Web
English
Sign In
Acemap
>
Paper
>
Low Temperature Cu to Cu Direct Bonding in Atmosphere Environment Using Pillar-Concave Structure in 3D Integration
Low Temperature Cu to Cu Direct Bonding in Atmosphere Environment Using Pillar-Concave Structure in 3D Integration
2017
T. C. Chou
Keywords:
Atmosphere
Direct bonding
Composite material
Pillar
Materials science
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
1
Citations
NaN
KQI
[]