Fine‐line Passive Components for Hybrid Microelectronics

A laser ablation technique has been used to fabricate conductor patterns on a 96% alumina substrate to evolve passive fine‐line components and structures. This paper reports the method of fabricating better fine‐line passive components for hybrid microelectronics application. The effect of a laser beam on the conductor and 96% alumina (Al2O3) substrate was studied in detail. Three predominant structures — namely debris, ablation border and irradiated bottom layer — were seen on the patterns. A detailed study of the dendritic growth caused by electrochemical migration on conductor lines fabricated by conventional screen printing and by laser ablation techniques is also reported.