Thermal management of the hotspots in 3-D integrated circuits
2018
Vertical integration for microelectronics possesses significant challenges
due to its fast dissipation of heat generated in multiple device planes.
This paper focuses on thermal management of a 3-D integrated circuit, and
micro-channel cooling is adopted to deal with the 3-D integrated
circuitthermal problems. In addition, thermal through-silicon vias are also
used to improve the capacity of heat trans-mission. It is found that
combination of microchannel cooling and thermal through-silicon vias can
remarkably alleviate the hotspots. The results presented in this paper are
expected to aid in the development of thermal design guidelines for 3-D
integrated circuits.
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