International Field Reversible Thermal Connector (RevCon) Challenge

Abstract : The University of Missouri hosted the DARPA Field Reversible Thermal Connector (RevCon) Challenge International RevCon Challenge for encouraging worldwide, driving college students to tackle challenging design problems in electronic thermal management. This event has expanded by creating better judgment on thermal performance with the combination of vibration and vacuum testing by experts from DARPA, AFRL, Rockwell Collins, Honeywell, Raytheon Integrated Defense Systems, BAE Systems, HRL, Lockheed Martin Space Systems Company, and Advanced Cooling Technologies Corp. Progressively challenging metrics were set for participating teams to achieve in subsequent challenges, leading to unique and novel prototype concepts from the teams. The thermal performance of the prototypes is generally outstanding: the majority outperforming advanced commercial-off-the-shelf (COTS) thermal connectors with thermal resistance values as low as 0.1 degree C/W. A manuscript, entitled Field-Reversible Thermal Connector (RevCon) Challenges: A Review has been submitted to IEEE- Transactions on Components, Packaging and Manufacturing Technology, and is currently under review.