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Development of Fan-Out type RDL package using minimal package processes
Development of Fan-Out type RDL package using minimal package processes
2018
Toru Mannami
Hiroko Kaneko
Nobuyoshi Yamauchi
Masanori Iwata
Kenji Miyake
Takafumi Yoshinaga
Sommawan Khumpuang
Shiro Hara
Keywords:
Redistribution layer
Fan-out
Computer science
Electronic engineering
Mechanical engineering
Materials science
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