Grinding wheel for super precise grinding si wafer

PURPOSE: To not only prevent the damage of an Si wafer but also form the wafer in a distortionless mirror state by a grinding wheel for superprecise grinding used for the Si wafer. CONSTITUTION: In a diamond grinding wheel or a cBN grinding wheel of resin bond or vitrified bond, a grinding wheel for grinding a superprecise Si wafer wherein BaCO 3 powder with a grain size of 1-20μm forms an aggregate and a filling rate 5-60vol.% is added is provided. COPYRIGHT: (C)1993,JPO&Japio