Design and analysis of liquid cooling plates for different flow channel configurations
2021
A number of thermal management devices are used to actuate concentrated
electronic appliances in an efficient way. A liquid cooling plate acts as a
heat sink enclosed by materialized walls. This work aims to carry out design
of liquid cooling plates such that the heat diffused by the electronic
equipment is removed while their temperatures levels remain within safe
limits. The liquid cooling plates expose “cold surfaces” to electronic
appliances. The performance of a cooling plate is estimated depending upon
heat carrying capacity, associated heat transfer rates and concentrated
thermal regions on the plate surface. For this study, the design of liquid
cooling plate was done with SOLIDWORKS. Pure water was used as a working
fluid in test channels. A comparative analysis of flow distribution,
temperature contours, pressure drop and pumping power for different channel
configurations was carried out with ANSYS. It was observed that a channel
configuration is of key importance in liquid cooling plates. The findings
from this study are beneficial for the optimum design of cooling systems for
high heat flux applications, i.e., in electronic devices, computer
processors and automotive engines.
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