Testing of an electromagnetic valve for two-phase cooling of microelectronics

The paper presents the behavior of an electromagnetic valve designed for two-phase cooling of high power density microelectronic circuits. The valve shows sufficient reaction time, less than 10 ms, to be able to cope with the fast dynamics of bubble formation inside the heat sink. The size and actuation force of the main valve is reduced by making use of a pilot valve capable of controlling a flow rate though the main valve of up to 4 g/s (15 kg/h). This flow rate is sufficient to remove a heat input of 133 W equivalent with a heat flux of 500 W/cm 2 at a temperature difference of 20 ° C. Its equilibrated design allows a pressure drop control of up to 1 bar at maximum system pressures of 6 bar.