Binder alloy and metallization structure

PURPOSE: To provide an interbound metallization structure to utilize the benefit characteristic of a solder alloy which exhibits a low melting temp. and a high resistance force against creep by combining this solder alloy and ball threshold metallurgy to minimize the electric transfer by incorporating the same. CONSTITUTION: A metal adhesion layer 60 is directly adhered to a passage 16 to adhere a metal conduction layer 62 to this metal adhesion layer 60. Further, a metal barrier layer 64 is adhered to this metal conduction layer 62. A solder alloy layer 30 consisting of 61 to 68% tin, 0.2 to 3.9% silver, 0.5 to 1.5% antimony and the balance lead is joined by aligning and heating to the metal conduction layer 62.