Pressure-resistant electrode paste for chip component using UV hardening and manufacturing method therewith

The present invention can improve the pattern (the electrode) to be printed on the ceramic sheet by using a photo-curing reaction of the UV curable resin itself strength and compression property, depending on the strength and compression property is improved in the pattern (the electrode) even if the external pressure caused by the pressing process, and do not deform from the design position and shape can exhibit the function of as a chip desired, by adjusting an amount of the UV curable resin efficiently within a compression property without degrading the performance of the electrically conductive filler, It can be increased, the ceramic sheet and the ceramic coating similar to the shrinkage behavior of a powder to progress in shrinkage matching property increases with the sheet and can prevent the dill lamination (delamination) of the electrode, and containing component and the softening point of the glass frit (Ts) via the control and promote the sintering of the ceramic proceeds to the start time of shrinkage, and shrinkage at the end of the core and the coating layer is similar to As relates to a pressure-resistant wearing electrode paste composition and a method for manufacturing a chip component by Using UV cured with the denseness of the sintered organization it can be markedly increased cut resistance.