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Flow Behavior Analysis of Emc in Molded Underfill (Muf) Encapsulation for Multi Flip-Chip Package
Flow Behavior Analysis of Emc in Molded Underfill (Muf) Encapsulation for Multi Flip-Chip Package
2018
M. A. Azmi
M.K. Abdullah
Maimon Abdullah
Zulkifli Mohamad Ariff
M. A. Ismail
M.S. Abdul Aziz
Keywords:
Flip chip
Encapsulation (computer programming)
Materials science
Electronic engineering
Optoelectronics
Flow (psychology)
Correction
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