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INFLUENCE OF DIAMOND WIRE SAWING PARAMETERS ON SUBSURFACE MICROCRACKS FORMATION IN MONOCRYSTALLINE SILICON WAFER
INFLUENCE OF DIAMOND WIRE SAWING PARAMETERS ON SUBSURFACE MICROCRACKS FORMATION IN MONOCRYSTALLINE SILICON WAFER
2019
Erick Cardoso Costa
Caroline Piesanti dos Santos
Fabio Antonio Xavier
Walter Lindolfo Weingaertner
Keywords:
Composite material
Diamond
Monocrystalline silicon
Wafer
Materials science
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