Processing and performance of broadband integrated resistor structures on non-planar topologies in hermetic silicon enclosure with vertical micro vias

We present the integration of thin film nickel-chromium (NiCr) resistors into a hermetic, 3D structured silicon packaging platform for wafer level sealing and demonstrate their performance as broadband passive components. Resistors on the cavity side walls can be designed by modeling the material deposition as a unidirectional flux.