Spectroscopic Ellipsometry as a Non-Destructive Technique for Characterization of Atomic-Scale Interfaces

Analysis of oxide interfaces with semi-conductor substrates, such as crystalline silicon, gallium arsenide, or indium phosphide is critical in processing and electrical performances. Interfaces can be characterized by spectroscopic ellipsometry (SE), which has a wide spectral range (1.3 to 5.3 eV ) allowing an optical penetration depth of 10 nm to a few microns. A multilayer stack can be characterized in terms of its layer thicknesses and composition. These physical parameters must be calculated through a mathematical model. Linear regression analysis is used to minimize the differences between the measured spectrum and the calculated model. If necessary, an interlayer can be introduced into the model to enhance the fit. This can be complemented by a new method involving calculation of apparent index values which amplifies interface sensivity allowing the thickness to be measured to better than 2 Angstroms. Examples will be given.