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And a thermosetting resin composition using the compound, a prepreg, a laminate, and a printed wiring board
And a thermosetting resin composition using the compound, a prepreg, a laminate, and a printed wiring board
2012
Tomohiko Kotake
Masato Miyatake
Shunsuke Nagai
Shintaro Hashimoto
Yasuo Inoue
Shin Takanezawa
Hikari Murai
Keywords:
compound a
Materials science
Thermosetting polymer
Composite material
Printed circuit board
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