A method of manufacturing an electronic component module

Preparing a core layer having a component mounting surface of the first wiring pattern is formed, a step of roughening the surface of the first wiring pattern, at least in part to cover the lands of the first wiring pattern after the roughening, placing a bonding material containing a thermosetting resin and solder particles, to prepare the electronic component having a terminal, a terminal, by landing on the land by means of a bonding material, mounting the electronic component on the component mounting surface a step, a core layer provided with the electronic component by the first heating, as well as joining the terminals to the lands by solder, a step of semi-curing the thermosetting resin, the electronic components mounted on the component mounting surface with the prepreg as enclosed, laminating the prepreg on the core layer, in a vacuum atmosphere, the laminated body of the core layer and the prepreg, with pressed in the stacking direction, by the second heat, the cured product of the prepreg Ri together to seal the electronic component, comprising a step of further advancing the curing of the thermosetting resin, a method of manufacturing an electronic component module.