The adhesive heat resistance of cured resins based on resorcinyl diglycidyl ether

Abstract It has been found that when epoxide resins based on resorcinyl diglycidyl ether and 4,4′-diaminodiphenylsulphone are cured on a metal substrate they peel from it at a certain temperature. It is proposed to characterize the adhesive heat resistance of the resins by this temperature. The causes of change in the adhesive heat resistance with change in curing conditions are analysed. Inclusions were discovered in the matrix of cured resin and these are considered to be undissolved hardener. It was found that there is a correlation between the concentration of these inclusions and adhesive heat resistance.