The catalyst support body with the passivation layer and to processes for the preparation thereof

The invention relates comprises a catalyst carrier body (1), the at least one housing (2) and a honeycomb body (4) and a passivation layer (14) comprises a plurality of single crystal agglomerations (27) with an average height (30) which are in the range of 0.3 to 1.5 microns. Furthermore, various manufacturing methods are proposed, which are particularly suitable for preparing such a catalyst carrier body (1). Thus, the formation of the passivation layer (14) takes place on the one hand by blending and / or mixing of an adhesive (5) with a passivating substance (6), which is subsequently applied, or by roughening a region using the manufacturing process beam machining, wherein a steel medium corundum particles (30) are used. In this way a barrier is created very simple and inexpensive, that prevents, for example, in the formation of solder connections that the liquid solder then distributed as a result of capillary effects beyond the desired connection areas also.