Applying Compressive Plasma Flows to Improve Adhesion in a Film-Support System

The present paper is devoted to the influence of the support surface roughness on adhesion of a film-support system (a stainless steel (St3) support + a copper film). The film was deposited using a magnetron. The film was 7 μm thick. Prior to coating with the copper film the sample surface was treated with Low-Energry Power High-Current Electron Beams (LEHCEB) or Compressive Plasma Flows (CPF). An experimental facility similar to the magnetoplasma compressor was made. The surface was exposed to LEHCEB in modes that make it smoother or rougher. The sample surface gets rougher, if treated with CPF. As the profilometry data show, the contact area rises 4 times. And this, in its turn, strengthens the adhesion.