Printed circuit board and method for preparing plating printed circuit board

An insulating substrate; A circuit pattern formed on the insulating substrate; And formed on the insulating substrate, a terminal portion extending from said circuit pattern; including, wherein the terminal portion is Au-based plating the top layer, Ni-based plating layer, and a Cu based alloy as a base layer is laminated, the coated top layer and the coating layer is nanocrystalline layer and, the Au-based la AT the plating thickness of the top layer, and the thickness of the Ni-based plating layer is defined to as NT, NT 1.5 ≤ x a printed circuit board is provided which satisfies log (1 / AT) ≤ 4.