Diamond Microfabrication by Imprinting with Nickel Mold under High Temperature

Abstract Diamond is a key material for quantum devices and sensors, microelectromechanical systems, and the next-generation electronic devices. Microfabrication technology of single-crystal diamond (SCD) for device fabrication and processing is required but hardly established. For example, photolithographic techniques using plasma induced etching for the microfabrication of the diamond devices induce damage to its diamond and deteriorate the device-performances. To overcome this problem, we propose a plasma-free imprint lithographic technique of SCD using Ni mold at high temperatures. Prior to contacting with SCD, the native surface oxide film of the Ni mold is reduced by a hydrogen annealing treatment. Then, the samples were contacted with Ni mold closely, and annealed at various temperatures from 800 to 1200 °C for 30 minutes, aiming at the formation of the microstructure on SCD surface by imprinting the structure of Ni mold based on the carbon solid solution reaction into Ni. After removing the Ni and the formed graphite by acid treatment from the SCD surface annealed at 1000 °C, imprints with Ni shape structure are revealed on SCD surface. This microstructure formation processes requires only short periods of time without any specific equipments. Therefore, this diamond imprint lithography is significant and practical for the development of the diamond applications.