Photosensitive organosilicon polymers for microlithographic application

Two new families of photosensitive organo-silicon polymers are described. One is based on the Si-Si σ-bond photochemistry and another is based on the combinations of new alkaline-soluble organosilicon polymers with diazoquinone photosensitizers. Both of these photoactive materials not only give positive photoresist formulations but can act as oxygen reactive ion etch masks in the double-layer resist scheme to finally offer steep submicrometer organic patterns with high aspect ratio.