16x16 VCSEL Array Flip-chip bonded to CMOS VLSI Circuit

We have flip-chip bonded a 16x16 array of970nm VCSELs to a Silicon CMOS circuit. The device yield after bonding and packaging of the Optoelectronic-VLSI chip is approximately 96%. Individual VCSELs are capable of being modulated by the circuit at IGbit/s. Parallel testing of up to 80VCSELs at IGbit/s per VCSEL is presented.