High density pixel detector module using flip chip and thin film technology

For the ATLAS experiment at the planned Large Hadron Collider LHC at CERN hybrid pixel detectors are be-ing built as innermost layers of the inner tracking detector system. Modules are the basic building blocks of the ATLAS pixel detector. A module consists of a sensor tile with an active area of 16.4 mm x 60.4 mm, 16 read out ICs, each serving 24 x 160 pixel unit cells, a module controller chip, an optical transceiver and the local signal interconnection and power distribution busses. The dice are attached by flip-chip assembly to the sensor diodes and the local busses. In the following a module based on MCM-D technology will be discussed and prototype results will be presented.