Old Web
English
Sign In
Acemap
>
Paper
>
Design and technology of flip chip and SMD devices integrated with LTCC module
Design and technology of flip chip and SMD devices integrated with LTCC module
2010
Jurków
Malecha
Czok
Roguszczak
Babiarz
Golonka
Keywords:
Flip chip
Integrated circuit layout
Surface-mount technology
Materials science
Electrical engineering
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]