QFN (Quad Flat No-lead Package) package framework structure

The invention provides a QFN (Quad Flat No-lead Package) package framework structure. By adopting the QFN package framework structure, the interference resistance of a heat conduction bonding pad and the capacity for shielding a high-frequency signal can be improved; moreover, the qualification rate of a packaged product can be increased. The QFN package framework structure comprises a plastic package body, wherein the plastic package body is in a square shape, the heat conduction bonding pad is arranged in the middle part of the bottom surface, and a conducting bonding pad is distributed on the periphery of the heat conduction bonding pad. The QFN package framework structure is characterized in that the heat conduction bonding pad is in a circular shape, and the conducting bonding pad is in a circular shape.