bonding device for bonding OLED window and board, bonding method using it

The invention relates to a laminating apparatus for the process is cementation the OLED window and the substrate for which prevent the air bubbles are not generated between the substrate to induce bending in which the substrate to be attached to each other and to occur in air (大氣) conditions for laminating the substrate , Base; Moving the stage in which the first substrate is mounted; A vertical gantry, and a lifting means adapted to wins Ghent Rie vertical lifting plate which is possibly combined; The pair of chucking unit for chucking by laminating the first substrate to the second substrate; And it bending the second substrate a rolling device for rolling the banded region; is configured to include a. Step (S10) to cementation method for achieving the object of the present invention, moving the first substrate of a pair of the lower chucking unit; Applying adhesive aekreul (S20); The step of chucking the clamp when supplied with the second substrate (S30); The step of lowering the clamp, while bending the second substrate (S40); Are attached to each other through; and the step of rolling, while the bending portion of the second substrate attached to each other to a second substrate to the first substrate (S50).